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Positive photo resist

2. KL 7000 Photoresist for IC fabrication
ㆍ  PFAS-Free Positive Photo Resist
ㆍ  CD: 0.55 μm
Thickness: 0.15 μm - 2.5 μm
ㆍ  Application: IC fabrication, interference or holographic lithography, diffraction grating
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
KL 7000 PFAS-Free Positive Photo Resist for IC fabrication
Description
Features
 - KL 7000 series are positive photoresists for use in i-line, g-line
  and broadband applications.
 - KL 7000 offers high sensitivity, and high throughput suitable for
  IC fabrication.
 - The KL7000 system is engineered to contain no PFAS and
  no Fluorine containing materials for environmental safety and
  demanding regulatory compliance.
 - Designed for use with industry standard MIF and MIB developers;
  optimized for 0.26N TMAH.
 - Achieve resolution 0.55 μm dense line/space and
  0.40 μm isolated line.
 - Competes with S1800™, AZ®1500, and other general use
  positive tone photoresist.		 - Tone: Positive.
 - Film Thickness: 0.15 - 3.0 μm.
 - Sensitivity: NUV, Broadband, i-line, h-line, g-line.
 - Developer: TMAH-based.
 - Remover: NMP, DMSO at 50–80 °C.
 - Products: KL 7002-TF, KL 7005, KL 7010, KL 7015, KL 7020.

Description
ProductFilm Thickness
Range (micorns)		Softbake Exposure
Broadband/NUV on Si		Post Exposure Bake (PEB)Develop 0.26N TMAHHardbake Recommended
 KL 7002-TF0.15 - 0.30 μm105°C
for 1 min		50 mJ/cm2115°C
for 1 min		30 secs
immersion		110°C
for 1 min
 KL 70050.4 - 1.0 μm30 mJ/cm2
 KL 70100.7 - 1.5 μm35 mJ/cm2
 KL 70151.2 - 2.5 μm40 mJ/cm2
 KL 70201.5 - 3.0 μm45 mJ/cm2

KL 7000  Series Thin Spin Curve
KL 7000  Series Thick Spin Curve
spin_curve.jpg
spin_curve1.jpg

Process results
1_5_um_FT.jpg
1.5 μm film thickness
0_55_um.JPG
CD: 0.55 μm
 
1_5_um_FT.jpg
    Exposure: 100 mJ i-line Stepper, NA=0.55
Related Products (Guide for Kemlab Positive Photoresists)
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.2
0.5
0.8
1
1.3
2
2.5
3
4
5
6
7
8
9
10
20
30
40
50
100
KL 5302 Hi-Res
  Interference Lithography (Link)  		Positive
  i-Line, Broadband, g-line  		KL 5302 Hi-Res                    
                    
KL 5300
General Purpose
(Link)		Positive
i-Line, Broadband, g-line		KL 5302                    
KL 5305                    
KL 5310                    
KL 5315                    
KL 6000
General Purpose Thick
(Link)		Positive
i-Line, Broadband, g-line		KL 6003                    
KL 6005                    
KL 6008                    
K-PRO
Packaging Resist (Link)		Positive
i-Line, Broadband, g-line		K-PRO 1                    
K-PRO 2                    
K-PRO 3                    
K-PRO 5                    
K-PRO 7                    
K-PRO 15                    
Related Products (Guide for Kemlab Neative Photoresists)
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.20.50.811.322.534567891020304050100
HARE SQ
Negative Epoxy (Link)		Negative
Epoxy Resist
i-Line, Broadband
MEMS, Microfluidics		SQ 2                    
SQ 5                    
SQ 10                    
SQ 25                    
SQ 50                    
KL Image Reversal
Lift Off (Link)		Positive / Negative
i-Line, Broadband, g-line		KL IR Lift-Off 15                    
KL IR 15                    
APOL-LO 3200
  Negative Lift Off Profle (Link)		Negative undercut profile
i-Line, Broadband		APOL-LO 3202                    
APOL-LO 3204                    
APOL-LO 3207                    
KL NPR
  Vertical Profile (Link)		Negative vertical profile
i-Line and Broadband		KL NPR 1                    
KL NPR 2                    
KL NPR 4                    
KL NPR 6                    
KL NPR 10