혁신에 열정을 더하다

제품소개

  • Wafer
  • Photo resist
  • E-beam resist
  • Spin coater & Hot plate
  • WETSEM
  • Coming soon

고객센터

Home > 제품소개 > Negative photo resist

Negative photo resist

6. APOL-LO 3200 Lift Off Photo Resist
ㆍ  Negative photo resist Lift-off profile
ㆍ  Thickness: 2 μm - 10 μm
Exposure: i-line and broadband
ㆍ  Application: Compound Semiconductors (CS), LEDs, RF, VCSEL
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
ㆍ  납기일: 3~5주 (평균 납기일: 24일, 2018년 납품 기준)
APOL-LO 3200 Lift-Off Negative Photo Resist
Description
Properties
 - APOL-LO 3200 Series Resist is a negative tone Advanced Photoresist with Lift-Off profile for i-Line, and broadband applications.  - Improved resolution and Wider process window.
 - Film Thickness range 2 – 10+ μm.
 - Designed for use with industry standard TMAH developers.
   - Customization available to: Adjust Lift-Off Angle and PhotoSpeed.

APOL-LO 3200 Series Spin Curve
APOL-LO 3200 Series Film Thickness Ragne
 APOL-LO-3200 Negative Photo Resist with Lift-Off Profiles. Spin curve.
Product microns App. Viscosity (cst)
APOL-LO 3202 2 - 4 25
APOL-LO 3204 3 - 6 67
APOL-LO 3207 5 - 10+ 180

APOL-LO 3200 Series: Lift Off Process Guide
Product:
Film Thickness		 APOL-LO 3202
  2 μm		 APOL-LO 3204
  4 μm		 APOL-LO 3204 and 3207
  6 μm		 APOL-LO 3207
   10 μm
Soft bake 110 °C for 60 sec 110 °C for 60 sec 110 °C for 60 sec 110 °C for 90 sec
Expose (broadband) on Si 140 mJ/cm2 145 mJ/cm2 150 mJ/cm2 200 mJ/cm2
Post Exposure Bake 110 °C for 60 sec 110 °C for 60 sec 110 °C for 90 sec 110 °C for 90 sec
Develop (TMAH 0.26N) 40 sec 60 sec 75 sec 120 sec

Stepper and Broadband Performance
Stepper Performance
APOL-LO 3202
Film Thickness: 2.2 μm
Exposure: Nikno i9c stepper
APOL-LO-3202 Negative Photo Resist with Lift-Off Profiles. Resolution 1.0 micron at fim thickness 2.2 micron by stepper.
    Resolution: 1 μm
APOL-LO-3202 Negative Photo Resist with Lift-Off Profiles. Resolution 0.8 micron at fim thickness 2.2 micron by stepper.
Resolution: 0.8 μm
APOL-LO-3202 Negative Photo Resist with Lift-Off Profiles. Resolution 0.7 micron at fim thickness 2.2 micron by stepper.
Resolution: 0.7 μm
APOL-LO-3202 Negative Photo Resist with Lift-Off Profiles. Resolution 0.6 micron at fim thickness 2.2 micron by stepper.
Resolution: 0.6 μm
       
Broadband Performance
APOL-LO 3207
Film Thickness: 6 μm FT
Exposure: Broadband
APOL-LO-3202 Negative Photo Resist with Lift-Off Profiles. Line and space 5 micron at fim thickness 6 micron by broadband.
5 μm l/s
APOL-LO-3202 Negative Photo Resist with Lift-Off Profiles. Line and space 4 micron at fim thickness 6 micron by broadband..
4 μm l/s
APOL-LO-3202 Negative Photo Resist with Lift-Off Profiles. Line and space 3 micron at fim thickness 6 micron by broadband.
    3 μm l/s

APOL LO 3200 Stepper Through Focus Profile
APOL-LO-3200 Negative Photo Resist. Through Focus Profile by stepper.

APOL-LO 3202 Metal Deposition and Lift -Off
Metal Deposition (evaporative) Lift-Off

APOL-LO_3202_metal_deposition
APOL-LO_3202_lift_off
Products Guide
Tone
Product (link)
Film Thickness (µm)
Feature
Adhesion Promoter SurPass NA Apply resist: Novolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ...
Negative HARE SQ series 2 – 100 and 200* Epoxy.
SQ QuickDry series 2 – 200 Epoxy, Quick drying solvent.
SQ MicroCoat series 0.05 – 2 Epoxy, Thin film, Surface protection.
SQ OptiCoat series 2 – 100 Epoxy, Higher transparency.
APOL-LO 3200 series 2 – 10+ Lift-off profile.
KL NPR series 1 – 20 Vertical profile.
Image Reversal KL IR 15,
KL IR Lift-Off 15		 1.2 – 2.6 Lift-off profile (negative),
Vertical profile (negative).
Positive KL 7000 series 0.15 – 3 High resolution, No PFAS and Fluorine.
KL 6000 series 2.5 – 11 General thick purpose.
K-PRO series 0.8 – 25 and 50* Plating and etch application.
Advanced packaging
Protective Surface Coating PSC-1003 2.4 – 5.3 Protective Surface Coating
PSC-IB DPM 1010 10 (@ 2000 RPM) Protective Surface Coating
* Double coating.