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Positive ebeam resist

2. SML positive e-beam resist (high resolution and aspect ration)
ㆍ  Positive e-beam resist (ZEP 대응 제품)
ㆍ  Very high resolution: < 10 nm
Slow etch rate
ㆍ  Very high aspect ration: > 10:1 @ 30 kV
                                        > 50:1 @ 100 kV
ㆍ  Safe and easy to use: specifically designed to fit into a standard PMMA process
ㆍ  저렴한 가격. 최소 용량 50 ml. 100 ml 용량 이상시 두께별로 50 ml씩 나눠서 공급 가능
ㆍ  납기일: 3~5주 (평균 납기일: 21일, 2018년 납품 기준)
SML Resist positive e-beam resist
Features
Properties
  - Positive Tone Resist
  - Very High Resolution: < 10 nm
  - Very High Aspect Ratio: < 10:1 @ 30 kV
                                            < 50:1 @ 100 kV
  - Slow Etch Rate
  - Thickness: 50 nm - 2000 nm
  - Superior contrast
  - Excellent surface adhesion (HMDS not required)
 Parameter /SML 50 100 300 600 1000 2000
 Thickness (μm) /
 4000 rpm		 0.05 0.11 0.3 0.6 1 2
 Resolution  value (nm) < 10
 Plasma etching rates (nm/min) Ar 5
SF6 + C4F8 Min. 17

 
Spin Curve
 
 
Spin Curve of SML50 and 100 Positive E-beam Resist wiht High Resolution and High Apect Ratio     Spin Curve of SML300 and 600 Positive E-beam Resist wiht High Resolution and High Apect Ratio     Spin Curve of SML1000 and 2000 Positive E-beam Resist wiht High Resolution and High Apect Ratio
 

Process results
SML50 Positive E-beam Resist wiht High Resolution and High Apect Ratio: Resolution 5 nanometer at film thickness 50 nanometer
SML50: resolution 5 nm (thickness: 50 nm)
SML300 Positive E-beam Resist wiht High Resolution and High Apect Ratio: Resolution 33 nanometer at film thickness 400 nanometer
SML300: resolution 33 nm (thickness: 400 nm)
SML50 Positive E-beam Resist wiht High Resolution and High Apect Ratio: Resolution 29.5 nanometer at film thickness 1930 nanometer (Aspect ratio: 65:1).
SML2000: resolution 29.5 nm (thickness: 1930 nm),
aspect ratio: 65:1
SML600 Positive E-beam Resist wiht High Resolution and High Apect Ratio - Aluminum features after metallisation:  58 nanometer wide, 500 nanometer tall, aspect ratio: 8.6:1
SML600 - Aluminum features after metallisation:
 58 nm wide, 500nm tall, aspect ratio: 8.6:1
Products Guide
Tone
Product (link)
Film Thickness (nm)
Feature
Adhesion PromoterSurPass seriesNAApply resist: Novolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ...
Negative ebeam resistHSQ series8 – 1,650Dilution: 1 - 45%.
Supply: Powder, Solution.
H-SiQ series25 – 850Dilution: 2 - 20%.
Supply: Powder, Solution.
AR-N 7520 New series100 – 800Best resolution: 28 nm.
e-beam, DUV, i-line.
Positive ebeam resistHARP PMMA series50  – 3,700m/W: 950K, 495K.
Dilution: 2 - 11 %.
HARP-C Copolymer series150  – 1,100MMA/MAA Copolyer.
  Dilution: 6 - 12 %.
PMMA series40  – 7,000m/W: 950K, 495K, 350K, 120K, 35K.
  Dilution: 1 - 18 %.
Copolymer series100  – 1,100Copolymer.
  Dilution: 1 - 13 %.
SML series50  – 4,800High resolution: 5 nm. Aspect ratio: >50:1.
  Slow etch rate.
Conductive layerDisCharge H2O series25 – 170Apply resist: PMMA, HSQ, mr-PosEBR, AR-P 6200, ZEP, SML.
Protective Surface CoatingPSC-10032.4 – 5.3Protective Surface Coating
PSC-IB DPM 101010 (@ 2000 RPM)Protective Surface Coating
* Double coating.