Home > 제품소개 > Positive ebeam resist
Description |
Applications | |
- HARP PMMA (polymethyl methacrylate) resist is designed for high resolution direct write e-Beam lithography. - When combined with HARP-C copolymer the HARP multi-layer system is ideal for T-gate manufacture. - HARP PMMA has excellent adhesion to a wide variety of substrates, and is used as a protective coating layer for wafer thinning and sacrificial layers. - 판매 용량: 500 ml, 1 L and 4 L. |
- e-beam direct write lithography. - Multi-layer T-gate manufacture. - X-Ray LIGA. - Protective Coating for wafer thinning. |
Product Offering |
Results | |
1000 HARP eB - Highest Mw (molecular weight) PMMA polymer. - Manufactured in Anisole. - Best resolution & contrast PMMA. - Competes with 950K PMMA. 500 HARP eB - PMMA Polymer with mid-range Mw (molecular weight). - Faster throughput versus 1000 HARP eB. - Manufactured in Anisole. - Competes with 495K PMMA. HARP-C - MMA/MAA (methyl methacrylate/methacrylic acid) copolymer. - Manufactured in Ethyl Lactate. - Used in multi-layer process with PMMA. - Competes with MMA(8.5)MAA. |
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HARP PMMA & Copolymer Products | ||||||||||||||||||||||||||||||||||||||||
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Spin Curves | |
Spin Curve: 500 HARP PMMA Series (thin) |
Spin Curve: 500 HARP PMMA Series (thick) |
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Spin Curve: 1000 HARP PMMA Series (thin) |
Spin Curve: 1000 HARP PMMA Series (thick) |
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Spin Curve: HARP-C Copolymer Series |
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Tone | Product (link) | Film Thickness (nm) | Feature |
Adhesion Promoter | SurPass series | NA | Apply resist: Novolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ... |
Negative ebeam resist | HSQ series | 8 – 1,650 | Dilution: 1 - 45%. Supply: Powder, Solution. |
H-SiQ series | 25 – 850 | Dilution: 2 - 20%. Supply: Powder, Solution. | |
AR-N 7520 New series | 100 – 800 | Best resolution: 28 nm. e-beam, DUV, i-line. | |
Positive ebeam resist | HARP PMMA series | 50 – 3,700 | m/W: 950K, 495K. Dilution: 2 - 11 %. |
HARP-C Copolymer series | 150 – 1,100 | MMA/MAA Copolyer. Dilution: 6 - 12 %. | |
PMMA series | 40 – 7,000 | m/W: 950K, 495K, 350K, 120K, 35K. Dilution: 1 - 18 %. | |
Copolymer series | 100 – 1,100 | Copolymer. Dilution: 1 - 13 %. | |
SML series | 50 – 4,800 | High resolution: 5 nm. Aspect ratio: >50:1. Slow etch rate. | |
Conductive layer | DisCharge H2O series | 25 – 170 | Apply resist: PMMA, HSQ, mr-PosEBR, AR-P 6200, ZEP, SML. |
Protective Surface Coating | PSC-1003 | 2.4 – 5.3 | Protective Surface Coating |
PSC-IB DPM 1010 | 10 (@ 2000 RPM) | Protective Surface Coating |