혁신에 열정을 더하다

제품소개

  • Wafer
  • Photo resist
  • E-beam resist
  • Spin coater & Hot plate
  • WETSEM
  • Coming soon

고객센터

Home > 제품소개 > Positive photo resist

Positive photo resist

4. K-PRO Photoresist for Packaging Applications
ㆍ  Positive photo resist for packaging applications
ㆍ  High sensitivity and throughput
ㆍ  Thickness: 5 μm - 25 μm
Exposure: i-Line, g-Line and broadband
ㆍ  저렴한 가격. 500ml, 1L, 1G 이외 용량 선택 가능
Test sample 제공 가능
ㆍ  납기일: 3~5주 (평균 납기일: 24일, 2018년 납품 기준)
K-PRO Photoresist for Packaging Applications
Description
Properties
 - K-PRO is a positive photoresist for use in i-Line, g-Line and
   broadband packaging applications.

 - K-PRO offers high sensitivity, high throughput, and excellent
   process latitude.
 - Application: Advanced packaging, TSV, Bumping, Plating.
 - Increased Heat Resistance.
 - Cover 5 – 25 microns in a single coat.
 - Designed for use with industry standard KOH, TMAH and
   potassium borate developers.
 - No PEB necessary.

K-PRO Spin Curve
K-PRO Absorbance
K-PRO Positive photo resist film thickness spin curve.jpg
K-PRO Positive photo resist absorbance (unexposed and exposed)

Process Guide
Product K-PRO 7 K-PRO 7 / K-PRO 15 K-PRO 15 K-PRO 15
Film Thickness 7 μm 10 μm 15 μm 25 μm
Soft bake 115 °C for 3 minutes 115 °C for 3.5 minutes 115 °C for 4 minutes 115 °C for 5.5 minutes
Rehydration Time 30 minutes 30 minutes 30 minutes 30 minutes
Exposure (broadband) 125 mJ/cm2 160 mJ/cm2 210 mJ/cm2 380 mJ/cm2

Process results
K-PRO Positive photo resist strip. 10 micrometers Cu post on Cu substrate.
Copper: Photoresist strip - 10 μm Cu Post on Cu substrate
K-PRO Positive photo resist. Copper: Plated Cu on Cu substrateFilm Thickness 15 μm: 10 μm line/space 1:1.
Copper: Plated Cu on Cu substrateFilm Thickness 15 μm: 10 μm line/space 1:1
K-PRO Positive photo resist on Si substrate. Film Thickness 25 μm: 15 μm line/space.
Silicon:
Film Thickness 25 μm: 15 μm line/space

K-PRO Positive photo resist. Copper Plating Application: 5um Cu Posts.
Copper Plating Applications: 5 μm Cu Posts
K-PRO Positive photo resist.  Film thickness 15um and 7um line and space.
15 μm film, 7 μm S/L
K-PRO Positive photo resist.  Film thickness 25um and 10um line and space.
25 μm film, 10 μm S/L
Related Products (Guide for Kemlab Photoresists)
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.20.50.811.322.534567891020304050100
KL 5302 Hi-Res
Interference Lithography (Link)
Positive
i-Line, Broadband, g-line
KL 5302 Hi-Res                    
                    
KL 5300
General Purpose
(Link)
Positive
i-Line, Broadband, g-line
KL 5302                    
KL 5305                    
KL 5310                    
KL 5315                    
KL 6000
General Purpose Thick
(Link)
Positive
i-Line, Broadband, g-line
KL 6003                    
KL 6005                    
KL 6008                    
K-PRO
Packaging Resist (Link)
Positive
i-Line, Broadband, g-line
K-PRO 7                    
K-PRO 715                    
                                                                                                                                                                             
Product Suite
Tone / Exposure
Product
Film Thickness (μm)
0.20.50.811.322.534567891020304050100
HARE SQ
Negative Epoxy
(Link)
Negative
Epoxy Resist
i-Line, Broadband
MEMS, Microfluidics
SQ 2                    
SQ 5                    
SQ 10                    
SQ 25                    
SQ 50                    
KL Image Reversal
Lift Off (Link)
Positive / Negative
i-Line, Broadband, g-line
KL IR-15 Lift Off                    
KL IR-15                    
APOL-LO 3200
Negative Lift Off
(Link)
Negative
i-Line, Broadband
APOL-LO 3202                    
APOL-LO 3204                    
APOL-LO 3207