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- KL IR15 Photoresist for Image Reversal (Lift Off and Vertical profile)
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DescriptionProperties
- KL IR15 series image reversal photoresists are used as either
positive and negative photoresist in i-line, g-line and broadband
applications.
- IR15: Designed for straight profiles when used as negative
photoresist.
- IR15 Lift Off: Designed for lift-off profiles when used as negative
photoresist.
- Application: Image reversal, Lift-off.
Positive Resist ModeNegative (Lift Off) Resist ModeSoftbake 105 °C for 90 seconds Exposure Broadband, i-lin, g-line PEB 115 °C for 60 seconds Development 0.26N TMAH Removal NMP / DMSO based strippers Softbake 105 °C for 90 seconds Exposure Broadband, i-lin, g-line Reversal Bake (critical step) 130 °C for 90 seconds Flood Exposure (non-critical) 150 mJ/cm2 (broadband) Development 0.26N TMAH Hardbake (optional) 130 °C for 60 seconds Removal NMP / DMSO based strippers
Process results 1Example Negative tone Lift-Off Process Example Gold Deposition & Lift Off Process Film Thickness 1.5 microns Film Thickness of PR 1.5 microns Broadband exposure 100 mJ/cm2 Film Thickness of Gold 150 nm Develop time 45 seconds puddle (recommended) Adhesion Layer Ti Results 
Results
(2, 3, 4 μm dense line/space after lift off)
Process results 2Example Positive tone Process Negative tone Process Film Thickness 1.5 microns 1.5 microns Broadband exposure ~ 70 mJ/cm2 ~ 70 mJ/cm2 Develop time 60 seconds puddle (recommended) 60 seconds puddle (recommended) Results 
- Related Products (Guide for Kemlab Photoresists)
- Product SuiteTone / ExposureProductFilm Thickness (μm)
0.2 0.5 0.8 1 1.3 2 2.5 3 4 5 6 7 8 9 10 20 30 40 50 100 KL 5302 Hi-Res
Interference Lithography (Link)Positive
i-Line, Broadband, g-lineKL 5302 Hi-Res KL 5300
General Purpose
(Link)Positive
i-Line, Broadband, g-lineKL 5302 KL 5305 KL 5310 KL 5315 KL 6000
General Purpose Thick
(Link)Positive
i-Line, Broadband, g-lineKL 6003 KL 6005 KL 6008 K-PRO
Packaging Resist (Link)Positive
i-Line, Broadband, g-lineK-PRO 7 K-PRO 715 Product SuiteTone / ExposureProductFilm Thickness (μm)0.2 0.5 0.8 1 1.3 2 2.5 3 4 5 6 7 8 9 10 20 30 40 50 100 HARE SQ
Negative Epoxy
(Link)Negative
Epoxy Resist
i-Line, Broadband
MEMS, MicrofluidicsSQ 2 SQ 5 SQ 10 SQ 25 SQ 50 KL Image Reversal
Lift Off (Link)Positive / Negative
i-Line, Broadband, g-lineKL IR-15 Lift Off KL IR-15 APOL-LO 3200
Negative Lift Off
(Link)Negative
i-Line, BroadbandAPOL-LO 3202 APOL-LO 3204 APOL-LO 3207
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