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Negative photo resist

7. SurPass adhesion promoter (spin coating)
ㆍ  Spin coating 방식의 adhesion promoter.
ㆍ  No dehydration bake is needed.
ㆍ  저렴한 가격. 0.5 L, 1 Gal, 4 Gal 다양한 용량.
SurPass adhesion promoter
Advantages in Lithographic Processing
Compatibility
  - Improved microlithographic resist, resist, polymer, and HSQ
    adhesion on a broad range of substrate materials.
  - Improved patterned resist mould to copper seed layer for
    subsequent electroforming operation.
  - Increased adhesion of evaporated metals to substrate materials.
  - Improved removal of critical substrate contaminants.
  - Improved adhesion may allow for reduction of EBL exposure
    energy for minimizing BSE emission reducing exposure time.
  - Reduced z-potential for improved coating properties.
  - May eliminate the need for thermally matched glass.
  - Eliminates need for substrate dehydration bake prior to
    processing.
  - Non-Hazardous waterborne formulation.
  - Substrate compatibility.
   SurPass has demonstrates excellent adhesion properties on a
   wide range of substrate materials, including glass, silicon nitride,
   metals, metal oxides, ceramics (ruby, sapphire) and plastics
   (PET).

  - Resist and Polymer Compatibility.
   SurPass has shown compatibility with most positive and negative
   resistand polymer formulations, providing excellent adhesion
   when used in conjunction phenolic resin Novolakresist
   (DNQ/Novolac/ma-N2400/Shipley1800), poly
   methylmethacrylate (PMMA), poly methylglutarimide (PMGI),
   epoxy based polymer (SU8), polyimide, electron beam resist
   (includingHSQ), chemically and non-chemically amplified
   photoresist.
   
Spray / Dispense / Spin Coat Application
Selection of Appropriate SurPass Primer
 Process step SurPass 3000 SurPass 4000
 Spin coat 3000 rpm / 30 seconds
 Bake No dehydration bake is needed
 Rinse Water (SU-8 IPA) Water or IPA
 Dry Spin dry or N2 blow
 Apply Resist Epoxy resist (SU-8),
    HSQ, Polymer, PR
Novolac Based Resist
  - SurPass 3000 is recommended for use with epoxy resists (SU-8)
    and HSQ e-beam resist.

  - SurPass 4000 is ideal for promoting adhesion of novolac resists
    (ma-N 1400, ma-N 2400, Shipley 1800, etc.).

Positive Tone DNQ / Novolac Resist (ma-P1200 series)
ma-P 1200, Film thickness = 7.5 μm, development in 0.22 to 0.26N TMAH
Control,
 Silicon Substrate
Con_Si.jpg
Bad adhesion of
small patterns
Si +
SurPass 4000
Si_SP4000.jpg
Excellent adhesion
 
SiO2 +
SurPass 4000
SiO2_SP4000.jpg
Excellent adhesion
 
Glass +
SurPass 4000
Glass_SP4000.jpg
Excellent adhesion
 
GaP +
SurPass 4000
GaP_SP4000.jpg
Excellent adhesion
 
Cu +
SurPass 4000
Cu_SP4000.jpg
Excellent adhesion
 

Negative Tone Aromatic Bisazide / Novolac Resist (ma-N 400, ma-N 1400 series)
ma-N 1400, Film thickness 1 μm, developed in ma-D533/S or 0.363 N TMAH
Control, Silicon Substrate
Ne_Con_Si.jpg
Bad adhesion
Si + SurPass 4000
Ne_Si_SP4000.jpg
Excellent adhesion
SiO2 + SurPass 4000
Ne_SiO2_SP4000.jpg
Excellent adhesion
Glass +  SurPass 4000
Ne_Glass_SP4000.jpg
Excellent adhesion
GaP +  SurPass 4000
Ne_GaP_SP4000.jpg
Excellent adhesion
ma-N 400, Film thickness = 7.5 μm, developed in ma-D 332S or 0.2N NaOH or 0.275N TMAH
Control, Silicon Substrate
Ne2_Con_Si.jpg
Bad adhesion
Si + SurPass 4000
Ne2_Si_SP4000.jpg
Excellent adhesion
SiO2 + SurPass 4000
Ne2_SiO2_SP4000.jpg
Excellent adhesion
Glass +  SurPass 4000
Ne2_Glass_SP4000.jpg
Excellent adhesion
GaP +  SurPass 4000
Ne2_GaP_SP4000.jpg
Excellent adhesion

Nickel Electroplate on Positive Tone DNQ / Novolac Resist (ma-P1200 series)
Nickel electroplate of ma-P 1200 resist mould on copper seed layer on Si carrier substrate
Po_Cu1.jpg
ma-P 1200 resist mold, 7.5 μm thick.
  Ni electroplated to 5 μm thickness on   Cu seed layer
Po_Cu2.jpg
ma-P 1200 resist mold, 30 μm thick.
  Ni electroplated to 25 μm thickness on  Cu seed layer

Epoxy Resist (SU-8)
Control, Silicon Substrate
Ne_Si.jpg  Ne_Si2.jpg
Poor adhesion of large patterns
Si+ SurPass 3000 treatment
Ne_SI_SP3000.jpg  Ne_SI_SP3000_2.jpg
Excellent Adhesion

Epoxy Resist (SU-8)
Epoxy_on_Si_SP3000.jpg
SU-8 epoxy resist on Si substrate treated with SurPass 3000
Epoxy_on_SiO2_SP3000.jpg
SU-8 epoxy resist on SiO2 substrate treated with SurPass 3000
Epoxy_on_Glass_SP3000.jpg
SU-8 epoxy resist on Glass substrate treated with SurPass 3000
Epoxy_on_TiOx_SP3000.jpg
SU-8 epoxy resist on TiOx substrate treated with SurPass 3000
Epoxy_on_Cu_on_Si_SP3000.jpg
SU-8 epoxy resist on Cr/Au on Si substrate treated with SurPass 3000

Improved Adhesion of HSQ Electron Beam Resist
SurPass greatly improves electron beam resist adhesion on III, IV, V metal oxide substrates,  
allowing for reduced exposure energy and improved process latitude for small and large  lithographic features.
HSQ_on_InGaAs_H.jpg
Fig 1: EBL exposure of HSQ resist on multilayer InGaAs
  No Treatment
  prior to application of resist
HSQ_on_InGaAs_SP3000_H.jpg
Fig 2: EBL exposure of HSQ resist on multilayer InGaAs
  Treated with SurPass 3000
  prior to application of HSQ resist
HSQ_on_InGaAs_SP3000_R_H.jpg
Fig 3: InGaAs multilayer system treated with SurPass
  3000 prior to application HSQ resist. Exposure dose
  reduced by factor of four
.
HSQ_on_InGaAs_SP3000_R1_H.jpg
Fig 4 : 30nm lithographic structures on InGaAs multilayer
  system treated with SurPass 3000 prior to application of
  HSQ. Exposure dose reduced by factor of four.