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Negative photo resist

2. HARE SQ High Aspect Ratio Epoxy Photoresist
ㆍ  High aspect ratio epoxy negative photo resist
ㆍ  SU-8 공정과 호환
Thickness: 2 μm - 100 μm
ㆍ  Application: MEMS, Microfluidics, Sensors, Pixel arrays
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L 이외 용량 선택 가능
ㆍ  납기일: 3~5주 (평균 납기일: 24일, 2018년 납품 기준)
HARE-SQ High Aspect Ratio Epoxy Negative Photoresist
Description
Properties
  HARE SQ seriesis an epoxy based negative photoresist designed
for polymeric MEMS, microfluidics, micromachining and  other
microelectronic  applications.
  The HARE SQ series system is designed for use in thick film
applications of 2 to 100 microns,and is ideal for use in permanent
applications in which  the photoresist remains within the finished device.		 - The HARE SQ series photoresist uses an epoxy resin with
 superior cleanliness and excellent reproducibility.
  - Consistent surface energy of crosslinked resist (an important
 property for microfluidic applications).
  - Fully compatible with SU-8 processes.

Film thickness vs. Spin speed
Percent transmittance vs. Wavelength
TF_612x444px.jpg
Transmittance_612x444px.jpg

Process Guide
Product:
Film thickness @ 2000 rpm		HARE SQ 2
2 μm		HARE SQ 5
5 μm		HARE SQ 10
10 μm		HARE SQ 25
25 μm		HARE SQ 50
50 μm		HARE SQ 50
100 μm
Softbake (2 step)65 °C for 1 min
95 °C for 1 min		65 °C for 1 min
95 °C for 3 min		65 °C for 2 min
95 °C for 5 min		65 °C for 3 min
95 °C for 7 min		65 °C for 5 min
95 °C for 15 min		65 °C for 10 min
95 °C for 30 min
Expose (broadband) on Si200 mJ/cm2180 mJ/cm2180 mJ/cm2180 mJ/cm2180 mJ/cm2180 mJ/cm2
Post Exposure Bake (2 step)65 °C for 1 min
95 °C for 2 min		65 °C for 1 min
95 °C for 2 min		65 °C for 1 min
95 °C for 2 min		65 °C for 1 min
95 °C for 3 min		65 °C for 1 min
95 °C for 5 min		65 °C for 2 min
95 °C for 10 min
Develop (immersion)1 min1 min2.5 mins3.5 mins6 mins15 mins

Process results
HARE_SQ_logo_ports_in_50um_film.jpg
Logo & posts in 50 μm film
HARE_SQ_5um_line_space_in_25um_film.jpg
5 μm dense line/space in 25 μm film
ARE_SQ_3.jpg
HARE_SQ_FT_200_um_2_RS.png
HARE_SQ_FT_200_um_1_RS.png
HARE_SQ_FT_100_um_1_RS.png
HARE_SQ_FT_200_um_3_RS.png
HARE_SQ_RS.png
Products Guide
Tone
Product (link)
Film Thickness (µm)
Feature
Adhesion Promoter SurPass NA Apply resist: Novolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ...
Negative HARE SQ series 2 – 100 and 200* Epoxy.
SQ QuickDry series 2 – 200 Epoxy, Quick drying solvent.
SQ MicroCoat series 0.05 – 2 Epoxy, Thin film, Surface protection.
SQ OptiCoat series 2 – 100 Epoxy, Higher transparency.
APOL-LO 3200 series 2 – 10+ Lift-off profile.
KL NPR series 1 – 20 Vertical profile.
Image Reversal KL IR 15,
KL IR Lift-Off 15		 1.2 – 2.6 Lift-off profile (negative),
Vertical profile (negative).
Positive KL 7000 series 0.15 – 3 High resolution, No PFAS and Fluorine.
KL 6000 series 2.5 – 11 General thick purpose.
K-PRO series 0.8 – 25 and 50* Plating and etch application.
Advanced packaging
Protective Surface Coating PSC-1003 2.4 – 5.3 Protective Surface Coating
PSC-IB DPM 1010 10 (@ 2000 RPM) Protective Surface Coating
* Double coating.