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2. AR 300-80 Adhesion Promoter

ㆍ	Adhesion Promoter
ㆍ	AR 300-80: spin coating 방식으로 도포

AR 300-80 new Adhesion Promoter

Characterisation

Properties

- Improvement of the adhesive strength of photo and
  e-beam resist films.
- Especially for surfaces with low adhesion properties, e.g. metal,
  SiO₂, GaAs
- AR 300-80 new: spin coating of a silicium organic solution =
  improved adhesion properties and simple, cheaper alternative to
  HDMS.

Parameter /AR	300-80 new
Density at 20 °C (g/cm³)	0.971
Flash point (°C)	46
Filtration (μm)	0.2
Storage temperature (°C)	10 - 22

Processing information AR 300-80 new

- AR 300-80 new is applied by spin coating between 1000 and 6000 rpm. The film thickness can be adjusted by varying the spin speed to the optimum conditions of the respective process.
- Higher spin speeds and thus thinner films are preferable, e.g. 4000 rpm with approx. 15 nm thickness. Too high concentrations (film thickness values) may reduce or neutralise the adhesion-promoting effect.
- It is recommended for AR 300-80 new to perform the subsequent tempering on a hot plate for 2 min or in a convection oven for 25 min at 180 °C. AR 300-80 new offers the big advantage for sensitive substrates that a bake step at olny 60 °C for the same amount of time is sufficient, even though higher temperatures are well tolerated.
- During tempering, a very uniform, extremely thin layer of adhesion promoter is generated on the substrate (approx. 15 nm). After cooling of the substrate, the resist can be applied as usual.
- An excess of adhesion promoter may be rinsed off with organic solvents like e.g. AR 600-71. The optimised surface properties are maintained without restriction.