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Negative photo resist

5. SQ QuickDry - Negative High Aspect Ratio Epoxy Fast Drying Photoresist
ㆍ  Negative High Aspect Ratio Epoxy Fast Drying Photoresist
ㆍ  Thickness: 2 μm - 200 μm
ㆍ  Quick drying solvent for increased throughput
ㆍ  저렴한 가격. 0.5 L, 1 L, 4 L, 16 L 이외 용량 선택 가능
ㆍ  납기일: 3 ~ 5 주
SQ QuickDry - Negative High Aspect Ratio Epoxy Fast Drying Photoresist
Description and Advantages
Features
 - SQ QuickDry is an epoxy-based negative photoresist designed for
 polymeric MEMS, microfluidics, micromachining and other
 microelectronic applications.
  - KemLab SU-8 epoxy photoresists use an epoxy resin  manufactured for microelectronics with superior cleanliness and  excellent lithographic reproducibility lot-to-lot compared to SU-8  legacy products.
  - Quick drying solvent for increased throughput.
  - High aspect ratio epoxy with vertical sidewalls.
  - Replaces SU-8 2000 series
  - Chemistry: SU-8 polymer epoxy.
  - Tone: Negative.
  - Film Thickness: 2 - 200 μm single coat.
  - Sensitivity: NUV, Broadband, i-line
                    (possible e-beam lithography).
  - Developer: HARE SQ Developer, SU-8 PGMEA.
  - Products: SQ QuickDry 2, 5, 25, 35, 50, 75.

Processing Guidelines
 
Product:
Film thickness:		SQ QuickDry 2
2 μm @ 3000 RPM		SQ QuickDry 5
5 μm @ 3000 RPM		SQ QuickDry 25
25 μm @ 3000 RPM		SQ QuickDry 35
35 μm @ 3000 RPM		SQ QuickDry 50
50 μm @ 3000 RPM		SQ QuickDry 75
75 μm @ 3000 RPM
Softbake
(Hot plate)		95 °C for 1 min95 °C for 2 mins95 °C for 5 mins  95 °C for 5 mins65 °C for 3 mins
95 °C for 7 mins		65 °C for 5 mins
95 °C for 15 mins
Exposure
(broadband on Si
with 360nm filter)		225 mJ/cm2225 mJ/cm2165 mJ/cm2180 mJ/cm2180 mJ/cm2210 mJ/cm2
Post Exposure Bake
(PEB)		95 °C for 2 mins95 °C for 3 mins  95 °C for 5 mins  95 °C for 5 mins65 °C for 1 min
  95 °C for 5 mins		65 °C for 1 min
  95 °C for 5 mins
Develop
(immersion)		1 min1 min4  mins5 mins6 mins12 mins

Spin Curves
HARE_SQ_QuickDry_Spin_Curve_Thin_RS.png
HARE_SQ_QuickDry_Spin_Curve_Thck_RS.png

SQ QuickDry Transmittance vs. Wavelength
SQ QuickDry Optical parameters
HARE_SQ_QuickDry_Transmittance_RS.png
HARE_SQ_QuickDry_Optical_parameters_RS.png

Process results
20 μm features, 100 μm HARE SQ QuickDry coating
20 μm features, 100 μm HARE SQ QuickDry coating
10 μm features, 25 μm HARE SQ QuickDry coating
10 μm features, 25 μm HARE SQ QuickDry coating
10 μm features, 100 μm HARE SQ QuickDry coating
10 μm features, 100 μm HARE SQ QuickDry coating
25 μm features, 50 μm HARE SQ QuickDry coating
25 μm features, 50 μm HARE SQ QuickDry coating
Products Guide
Tone
Product (link)
Film Thickness (µm)
Feature
Adhesion Promoter SurPass NA Apply resist: Novolac, DNQ, PMMA, HSQ, PMGI, SU-8, SML, PI, ...
Negative HARE SQ series 2 – 100 and 200* Epoxy.
SQ QuickDry series 2 – 200 Epoxy, Quick drying solvent.
SQ MicroCoat series 0.05 – 2 Epoxy, Thin film, Surface protection.
SQ OptiCoat series 2 – 100 Epoxy, Higher transparency.
APOL-LO 3200 series 2 – 10+ Lift-off profile.
KL NPR series 1 – 20 Vertical profile.
Image Reversal KL IR 15,
KL IR Lift-Off 15		 1.2 – 2.6 Lift-off profile (negative),
Vertical profile (negative).
Positive KL 7000 series 0.15 – 3 High resolution, No PFAS and Fluorine.
KL 6000 series 2.5 – 11 General thick purpose.
K-PRO series 0.8 – 25 and 50* Plating and etch application.
Advanced packaging
Protective Surface Coating PSC-1003 2.4 – 5.3 Protective Surface Coating
PSC-IB DPM 1010 10 (@ 2000 RPM) Protective Surface Coating
* Double coating.